Integrated Device Technology, Inc. 70T9159L7BF | 搜芯易Sourcengine

Integrated Device Technology, Inc. 70T9159L7BF

生命周期状态
Transferred
说明
CABGA 10.00x10.00x1.40 mm 0.80mm Pitch
类别
Semiconductors Memory ICs SRAMs MULTI-PORT SRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
Width (mm)
10
Length (mm)
1
JESD-30 Code
S-PBGA-B100
Memory Width
9
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Memory IC Type
MULTI-PORT SRAM
Operating Mode
SYNCHRONOUS
Number of Ports
2
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Lead (Sn63Pb37)
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Memory Organization
16KX9
Number of Functions
1
Number of Terminals
100
Terminal Pitch (mm)
0.8
Access Time-Max (ns)
7
Number of Words Code
16K
Memory Density (bits)
147456
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.5
Supply Voltage-Max (V)
2.6
Supply Voltage-Min (V)
2.4
Supply Voltage-Nom (V)
2.5
Number of Words (words)
16384
Standby Current-Max (A)
0.003
Standby Voltage-Min (V)
2.4
Supply Current-Max (mA)
200
Package Equivalence Code
BGA100,10X10,32
Clock Frequency-Max (MHz)
83
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
240
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
20