Integrated Device Technology, Inc. 70T633S12BF8 | 搜芯易Sourcengine

Integrated Device Technology, Inc. 70T633S12BF8

生命周期状态
Transferred
说明
CABGA 15.00x15.00x1.40 mm 0.80mm Pitch
类别
Semiconductors Memory ICs SRAMs MULTI-PORT SRAM

ECCN
3A991.B.2.A
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
Width (mm)
15
Length (mm)
15
JESD-30 Code
S-PBGA-B208
Memory Width
18
Package Code
LFBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Memory IC Type
MULTI-PORT SRAM
Operating Mode
ASYNCHRONOUS
Number of Ports
2
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Memory Organization
512KX18
Number of Functions
1
Number of Terminals
208
Terminal Pitch (mm)
0.8
Access Time-Max (ns)
12
Number of Words Code
512K
Memory Density (bits)
9437184
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1.5
Supply Voltage-Max (V)
2.6
Supply Voltage-Min (V)
2.4
Supply Voltage-Nom (V)
2.5
Number of Words (words)
524288
Standby Current-Max (A)
0.01
Standby Voltage-Min (V)
2.4
Supply Current-Max (mA)
355
Package Equivalence Code
BGA208,17X17,32
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
20