Integrated Device Technology, Inc. 70T3719MS166BB | 搜芯易Sourcengine

Integrated Device Technology, Inc. 70T3719MS166BB

生命周期状态
Transferred
说明
Application Specific SRAM, 256KX72, 12ns, CMOS, PBGA324
类别
Semiconductors Memory ICs SRAMs APPLICATION SPECIFIC SRAM

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
S-PBGA-B324
Memory Width
72
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Memory IC Type
APPLICATION SPECIFIC SRAM
Operating Mode
SYNCHRONOUS
Number of Ports
2
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
BOTTOM
Memory Organization
256KX72
Number of Functions
1
Number of Terminals
324
Terminal Pitch (mm)
1
Access Time-Max (ns)
12
Number of Words Code
256K
Memory Density (bits)
18874368
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Supply Voltage-Max (V)
2.6
Supply Voltage-Min (V)
2.4
Supply Voltage-Nom (V)
2.5
Number of Words (words)
262144
Standby Current-Max (A)
0.02
Standby Voltage-Min (V)
2.4
Supply Current-Max (mA)
900
Package Equivalence Code
BGA324,18X18,40
Clock Frequency-Max (MHz)
166
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0