Integrated Device Technology, Inc. 70T3589S133DR | 搜芯易Sourcengine

Integrated Device Technology, Inc. 70T3589S133DR

生命周期状态
Transferred
REACH
REACH compliant
说明
PQFP 28.00x28.00x3.50 mm 0.50mm Pitch
类别
Semiconductors Memory ICs SRAMs MULTI-PORT SRAM

ECCN
3A991.b.2.a
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
Width (mm)
28
Length (mm)
28
JESD-30 Code
S-PQFP-G208
Memory Width
36
Package Code
FQFP
Package Shape
SQUARE
Package Style
FLATPACK, FINE PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
J-STD-609 Code
e0
Memory IC Type
MULTI-PORT SRAM
Operating Mode
SYNCHRONOUS
Number of Ports
2
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Memory Organization
64KX36
Number of Functions
1
Number of Terminals
208
Terminal Pitch (mm)
0.5
Access Time-Max (ns)
15
Number of Words Code
64K
Memory Density (bits)
2359296
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
4.1
Supply Voltage-Max (V)
2.6
Supply Voltage-Min (V)
2.4
Supply Voltage-Nom (V)
2.5
Number of Words (words)
65536
Standby Current-Max (A)
0.015
Standby Voltage-Min (V)
2.4
Supply Current-Max (mA)
370
Package Equivalence Code
QFP208,1.2SQ,20
Clock Frequency-Max (MHz)
133
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0