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70P269L90BYGI

Integrated Device Technology, Inc.

Integrated Device Technology, Inc. 70P269L90BYGI
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.41
  • SB Code
    8542.32.00.40
  • Width
    6 mm
  • Length
    6 mm
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B100
  • Memory Width
    16
  • Organization
    16KX16
  • Package Code
    VFBGA
  • JESD-609 Code
    e1
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    262144 bit
  • Memory IC Type
    MULTI-PORT SRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.5 mm
  • Access Time-Max
    60 ns
  • Number of Ports
    2
  • Number of Words
    16384 words
  • Parallel/Serial
    PARALLEL
  • Terminal Finish
    TIN SILVER COPPER
  • Seated Height-Max
    1 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    60 mA
  • Number of Functions
    1
  • Number of Terminals
    100
  • Standby Current-Max
    0.006 Amp
  • Number of Words Code
    16K
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    BGA100,10X10,20
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3 V
  • Supply Voltage-Min (Vsup)
    1.8 V
  • Supply Voltage-Nom (Vsup)
    2.6 V
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    30

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70P269L90BYGI
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70P269L90BYGI