Integrated Device Technology, Inc. 70P264L55BYGI | 搜芯易Sourcengine

Integrated Device Technology, Inc. 70P264L55BYGI

生命周期状态
Transferred
RoHS
符合RoHS标准
REACH
REACH compliant
说明
CABGA 5.00x5.00x1.00 mm 0.50mm Pitch
类别
Semiconductors Memory ICs SRAMs MULTI-PORT SRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
S-PBGA-B81
Memory Width
16
Organization
16KX16
Package Code
BGA
JESD-609 Code
e1
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
262144 bit
Memory IC Type
MULTI-PORT SRAM
Operating Mode
ASYNCHRONOUS
Terminal Pitch
0.5 mm
Access Time-Max
55 ns
Number of Ports
2
Number of Words
16384 words
Parallel/Serial
PARALLEL
Terminal Finish
TIN SILVER COPPER
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Supply Current-Max
25 mA
Number of Functions
1
Number of Terminals
81
Standby Current-Max
6.0E-6 Amp
Number of Words Code
16K
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Package Equivalence Code
BGA81,9X9,20
Operating Temperature-Max
85 Cel
Operating Temperature-Min
-40 Cel
Supply Voltage-Max (Vsup)
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260