Integrated Device Technology, Inc. 70P258L55BYI | 搜芯易Sourcengine

Integrated Device Technology, Inc. 70P258L55BYI

生命周期状态
Discontinued
说明
Multi-Port SRAM, 8KX16, 55ns, CMOS, PBGA100
类别
Semiconductors Memory ICs SRAMs MULTI-PORT SRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
Width (mm)
6
Length (mm)
6
JESD-30 Code
S-PBGA-B100
Memory Width
16
Package Code
VFBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
J-STD-609 Code
e0
Memory IC Type
MULTI-PORT SRAM
Operating Mode
ASYNCHRONOUS
Number of Ports
2
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Memory Organization
8KX16
Number of Functions
1
Number of Terminals
100
Terminal Pitch (mm)
0.5
Access Time-Max (ns)
55
Number of Words Code
8K
Memory Density (bits)
131072
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
1
Supply Voltage-Max (V)
1.9
Supply Voltage-Min (V)
1.7
Supply Voltage-Nom (V)
1.8
Number of Words (words)
8192
Standby Current-Max (A)
8.0E-6
Standby Voltage-Min (V)
1.7
Supply Current-Max (mA)
25
Package Equivalence Code
BGA100,10X10,20
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40
Time@Peak Reflow Temperature-Max (s)
30