Integrated Device Technology, Inc. 709179L12PF | 搜芯易Sourcengine

Integrated Device Technology, Inc. 709179L12PF

生命周期状态
Transferred
说明
TQFP 14.00x14.00x1.40 mm 0.50mm Pitch
类别
Semiconductors Memory ICs SRAMs MULTI-PORT SRAM

ECCN
3A991.b.2.b
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

Technology
CMOS
Width (mm)
14
Length (mm)
14
JESD-30 Code
S-PQFP-G100
Memory Width
9
Package Code
QFP
Package Shape
SQUARE
Package Style
FLATPACK Meter
Surface Mount
YES
Terminal Form
GULL WING
J-STD-609 Code
e0
Memory IC Type
MULTI-PORT SRAM
Operating Mode
SYNCHRONOUS
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Memory Organization
32KX9
Number of Functions
1
Number of Terminals
100
Terminal Pitch (mm)
0.5
Access Time-Max (ns)
12
Number of Words Code
32K
Memory Density (bits)
294912
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
1.6
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
32768
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
240
Operating Temperature-Max (Cel)
70
Operating Temperature-Min (Cel)
0
Time@Peak Reflow Temperature-Max (s)
20