Integrated Device Technology, Inc. 70825S35PFI | 搜芯易Sourcengine

Integrated Device Technology, Inc. 70825S35PFI

生命周期状态
Transferred
REACH
REACH compliant
说明
TQFP 14.00x14.00x1.40 mm 0.65mm Pitch
类别
Semiconductors Memory ICs SRAMs APPLICATION SPECIFIC SRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

Technology
CMOS
JESD-30 Code
S-PQFP-G80
Memory Width
16
Organization
8KX16
Package Code
QFP
JESD-609 Code
e0
Package Shape
SQUARE
Package Style
FLATPACK Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory Density
131072 bit
Memory IC Type
APPLICATION SPECIFIC SRAM
Terminal Pitch
0.635 mm
Access Time-Max
35 ns
Number of Words
8192 words
Terminal Finish
TIN LEAD
Temperature Grade
INDUSTRIAL
Terminal Position
QUAD
Supply Current-Max
340 mA
Number of Terminals
80
Standby Current-Max
0.015 Amp
Number of Words Code
8K
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
QFP80,.64SQ
Operating Temperature-Max
85 Cel
Operating Temperature-Min
-40 Cel
Supply Voltage-Nom (Vsup)
5 V
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
240