Integrated Device Technology, Inc. 7050L25G | 搜芯易Sourcengine

Integrated Device Technology, Inc. 7050L25G

生命周期状态
Transferred
REACH
REACH compliant
说明
PGA 30.48x30.48x3.68 mm 2.54mm Pitch
类别
Semiconductors Memory ICs SRAMs MULTI-PORT SRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
S-PQFP-G132
Memory Width
8
Organization
1KX8
Package Code
QFP
JESD-609 Code
e0
Package Shape
SQUARE
Package Style
FLATPACK Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory Density
8192 bit
Memory IC Type
MULTI-PORT SRAM
Operating Mode
ASYNCHRONOUS
Terminal Pitch
2.54 mm
Access Time-Max
25 ns
Number of Ports
4
Number of Words
1024 words
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Additional Feature
BATTERY BACKUP OPERATION
Supply Current-Max
305 mA
Number of Functions
1
Number of Terminals
132
Standby Current-Max
0.0006 Amp
Standby Voltage-Min
2 V
Number of Words Code
1K
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Package Equivalence Code
PGA108,12X12
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
240