Integrated Device Technology, Inc. 7015L35J | 搜芯易Sourcengine

Integrated Device Technology, Inc. 7015L35J

生命周期状态
Transferred
说明
PLCC 24.00x24.00x3.63 mm 1.27mm Pitch
类别
Semiconductors Memory ICs SRAMs MULTI-PORT SRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

Width
24.2062 mm
Length
24.2062 mm
I/O Type
COMMON
Technology
CMOS
JESD-30 Code
S-PQCC-J68
Memory Width
9
Organization
8KX9
Package Code
QCCJ
JESD-609 Code
e0
Package Shape
SQUARE
Package Style
CHIP CARRIER Meter
Surface Mount
YES
Terminal Form
J BEND
Memory Density
73728 bit
Memory IC Type
MULTI-PORT SRAM
Operating Mode
ASYNCHRONOUS
Terminal Pitch
1.27 mm
Access Time-Max
35 ns
Number of Ports
2
Number of Words
8192 words
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
Seated Height-Max
4.57 mm
Temperature Grade
COMMERCIAL
Terminal Position
QUAD
Additional Feature
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
Supply Current-Max
210 mA
Number of Functions
1
Number of Terminals
68
Standby Current-Max
0.005 Amp
Standby Voltage-Min
4.5 V
Number of Words Code
8K
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Package Equivalence Code
LDCC68,1.0SQ
Operating Temperature-Max
70 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
225
Time@Peak Reflow Temperature-Max (s)
20