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5962-9561701MPX

Xilinx,Inc.

Xilinx,Inc. 5962-9561701MPX
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • JESD-30 Code
    R-GDIP-T8
  • Memory Width
    1
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory IC Type
    CONFIGURATION MEMORY
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    256KX1
  • Number of Functions
    1
  • Number of Terminals
    8
  • Number of Words Code
    256K
  • Memory Density (bits)
    262144
  • Package Body Material
    CERAMIC, GLASS-SEALED
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    262144
  • Clock Frequency-Max (MHz)
    12.5
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    MIL-STD-883

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5962-9561701MPX
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5962-9561701MPX