Integrated Device Technology, Inc. 5962-9161702MYA | 搜芯易Sourcengine

Integrated Device Technology, Inc. 5962-9161702MYA

生命周期状态
Transferred
说明
FPACK 29.20x29.21x2.54 mm 1.27mm Pitch
类别
Semiconductors Memory ICs SRAMs MULTI-PORT SRAM

ECCN
3A001.A.2.C
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
Width (mm)
29.21
Length (mm)
29.21
JESD-30 Code
S-XQFP-F84
Memory Width
16
Package Code
DFP
Output Enable
YES
Package Shape
SQUARE
Package Style
FLATPACK Meter
Surface Mount
YES
Terminal Form
FLAT
J-STD-609 Code
e0
Memory IC Type
MULTI-PORT SRAM
Operating Mode
ASYNCHRONOUS
Number of Ports
2
Parallel/Serial
PARALLEL
Terminal Finish
Tin/Lead (Sn/Pb)
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
QUAD
Additional Feature
INTERRUPT FLAG; ARBITER; SEMAPHORE
Memory Organization
8KX16
Number of Functions
1
Number of Terminals
84
Terminal Pitch (mm)
1.27
Access Time-Max (ns)
70
Number of Words Code
8K
Memory Density (bits)
131072
Package Body Material
UNSPECIFIED
Output Characteristics
3-STATE
Seated Height-Max (mm)
3.56
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
8192
Standby Current-Max (A)
0.004
Standby Voltage-Min (V)
2
Supply Current-Max (mA)
330
Package Equivalence Code
QFL84,1.2SQ
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
240
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Screening Level / Reference Standard
MIL-STD-883