Integrated Device Technology, Inc. 5962-3829410MXA | 搜芯易Sourcengine

Integrated Device Technology, Inc. 5962-3829410MXA

生命周期状态
Transferred
说明
CDIP 37.20x15.24x1.65 mm 2.54mm Pitch
类别
Semiconductors Memory ICs SRAMs OTHER SRAM

ECCN
3A001.A.2.C
ECCN Governance
EAR
HTS Code
8542.32.00.41
SB Code
8542.32.00.40

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
R-GDIP-T28
Memory Width
8
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE Meter
Surface Mount
NO
Terminal Form
THROUGH-HOLE
J-STD-609 Code
e0
Memory IC Type
OTHER SRAM
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
Terminal Finish
TIN LEAD
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
DUAL
Memory Organization
8KX8
Number of Functions
1
Number of Terminals
28
Terminal Pitch (mm)
2.54
Access Time-Max (ns)
45
Number of Words Code
8K
Memory Density (bits)
65536
Package Body Material
CERAMIC, GLASS-SEALED
Output Characteristics
3-STATE
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
8192
Standby Current-Max (A)
0.0003
Standby Voltage-Min (V)
2
Supply Current-Max (mA)
105
Package Equivalence Code
DIP28,.6
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
240
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Screening Level / Reference Standard
MIL-STD-883