MICROSS COMPONENTS 5962-0824501HYA | 搜芯易Sourcengine

MICROSS COMPONENTS 5962-0824501HYA

生命周期状态
Discontinued
REACH
REACH compliant
说明
Flash, 2MX32, 120ns, CPGA66
类别
Semiconductors Memory ICs Flash Memories FLASH

ECCN
3A001.a.2.c
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

Type
NOR TYPE
Boot Block
BOTTOM
Technology
CMOS
Toggle Bit
YES
Width (mm)
30.099
Length (mm)
30.099
Data Polling
YES
JESD-30 Code
S-CPGA-P66
Memory Width
32
Package Code
PGA
Package Shape
SQUARE
Package Style
GRID ARRAY Meter
Surface Mount
NO
Terminal Form
PIN/PEG
Memory IC Type
FLASH
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
DLA Qualification
Not Qualified
Temperature Grade
MILITARY
Terminal Position
PERPENDICULAR
Additional Feature
BOTTOM BOOT BLOCK
Memory Organization
2MX32
Number of Functions
1
Number of Terminals
66
Sector Size (words)
16K,8K,32K,64K
Terminal Pitch (mm)
2.54
Access Time-Max (ns)
120
Number of Words Code
2M
Memory Density (bits)
67108864
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Command User Interface
YES
Number of Sectors/Size
1,2,1,31
Seated Height-Max (mm)
6.223
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
3
Supply Voltage-Nom (V)
3.3
Number of Words (words)
2097152
Programming Voltage (V)
3
Standby Current-Max (A)
0.00025
Supply Current-Max (mA)
140
Package Equivalence Code
PGA66,11X11
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Screening Level / Reference Standard
MIL-STD-883