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3DLV3208VS1373MB

3D PLUS SA

3D PLUS SA 3DLV3208VS1373MB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    5.5
  • Length (mm)
    14.1
  • JESD-30 Code
    R-PDSO-G34
  • Package Code
    SSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Interface IC Type
    LINE RECEIVER
  • Terminal Position
    DUAL
  • Interface Standard
    EIA-644; TIA-644
  • Number of Functions
    8
  • Number of Terminals
    34
  • Terminal Pitch (mm)
    0.65
  • Input Characteristics
    DIFFERENTIAL
  • Package Body Material
    PLASTIC/EPOXY
  • Receive Delay-Max (ns)
    6
  • Seated Height-Max (mm)
    5.55
  • Supply Voltage-Nom (V)
    3.3
  • Receiver Number of Bits
    8
  • Package Equivalence Code
    SSOP34,.3
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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3DLV3208VS1373MB
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3DLV3208VS1373MB