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3DFO2G16VB2361MSP-00

3D PLUS SA

3D PLUS SA 3DFO2G16VB2361MSP-00
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Technology
    CMOS
  • Width (mm)
    11.7
  • Length (mm)
    13.7
  • JESD-30 Code
    R-PBGA-B64
  • Memory Width
    16
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Temperature Grade
    MILITARY
  • Terminal Position
    BOTTOM
  • Additional Feature
    SEATED HGT NOMINAL
  • Memory Organization
    128MX16
  • Number of Functions
    1
  • Number of Terminals
    64
  • Terminal Pitch (mm)
    1
  • Number of Words Code
    128M
  • Memory Density (bits)
    2147483648
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    3.9
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3
  • Number of Words (words)
    134217728
  • Programming Voltage (V)
    2.7
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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