3D PLUS SA 3DFN8G08VS1307MSP-00 | 搜芯易Sourcengine

3D PLUS SA 3DFN8G08VS1307MSP-00

生命周期状态
Discontinued
说明
Flash, 1GX8, PDSO50
类别
Semiconductors Memory ICs Flash Memories FLASH

ECCN
3A001.a.2.c
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

Technology
CMOS
Width (mm)
13.64
Length (mm)
18.7
JESD-30 Code
R-PDSO-G50
Memory Width
8
Package Code
SSOP
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory IC Type
FLASH
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
Temperature Grade
MILITARY
Terminal Position
DUAL
Memory Organization
1GX8
Number of Functions
1
Number of Terminals
50
Terminal Pitch (mm)
0.5
Number of Words Code
1G
Memory Density (bits)
8589934592
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
4.1
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
2.7
Supply Voltage-Nom (V)
3.3
Number of Words (words)
1073741824
Programming Voltage (V)
2.7
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55