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3DFN64G08VS8695IB-00

3D PLUS SA

3D PLUS SA 3DFN64G08VS8695IB-00
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Width
    13.64 mm
  • Length
    19 mm
  • Endurance
    100000 Write/Erase Cycles
  • Page Size
    4K words
  • Technology
    CMOS
  • Toggle Bit
    NO
  • Data Polling
    NO
  • JESD-30 Code
    R-PDSO-G50
  • Memory Width
    8
  • Organization
    8GX8
  • Package Code
    SSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    68719476736 bit
  • Memory IC Type
    FLASH MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Terminal Pitch
    0.5 mm
  • Number of Words
    8589934592 words
  • Parallel/Serial
    PARALLEL
  • Write Protection
    HARDWARE
  • Seated Height-Max
    12.2 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Additional Feature
    51 MILLIAMP SUPPLY CURRENT AND 400 MICROAMP STANDBY CURRENT IS AVAILABLE
  • Number of Functions
    1
  • Number of Terminals
    50
  • Programming Voltage
    2.7 V
  • Number of Words Code
    8G
  • Package Body Material
    PLASTIC/EPOXY
  • Command User Interface
    NO
  • Data Retention Time-Min
    10
  • Package Equivalence Code
    SSOP50,.79,20
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    2.7 V

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