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3DFN32G08VS8633MBH-00L

3D PLUS SA

3D PLUS SA 3DFN32G08VS8633MBH-00L
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NAND TYPE
  • I/O Type
    COMMON
  • Ready/Busy
    YES
  • Technology
    CMOS
  • Width (mm)
    13.64
  • Length (mm)
    19
  • JESD-30 Code
    R-PDSO-G50
  • Memory Width
    8
  • Package Code
    SSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory IC Type
    FLASH MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Write Protection
    HARDWARE
  • Page Size (words)
    2K
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Memory Organization
    4GX8
  • Number of Functions
    1
  • Number of Terminals
    50
  • Terminal Pitch (mm)
    0.5
  • Number of Words Code
    4G
  • Memory Density (bits)
    34359738368
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    12.2
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3.3
  • Data Retention Time-Min
    10
  • Number of Words (words)
    4294967296
  • Programming Voltage (V)
    3.3
  • Standby Current-Max (A)
    0.0004
  • Supply Current-Max (mA)
    37
  • Package Equivalence Code
    SSOP50,.8,20
  • Endurance (Write/Erase Cycles)
    100000
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

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3DFN32G08VS8633MBH-00L
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3DFN32G08VS8633MBH-00L