3D PLUS SA 3DFN16G08VS1712IB-00 | 搜芯易Sourcengine

3D PLUS SA 3DFN16G08VS1712IB-00

生命周期状态
Contact Mfr
说明
Flash Module, 2GX8, PDSO50
类别
Semiconductors Memory ICs Flash Memories FLASH MODULE

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.51
SB Code
8542.32.00.50

Type
NAND TYPE
Technology
CMOS
Width (mm)
13.64
Length (mm)
18.7
JESD-30 Code
R-PDSO-G50
Memory Width
8
Package Code
SSOP
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory IC Type
FLASH MODULE
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
Temperature Grade
INDUSTRIAL
Terminal Position
DUAL
Memory Organization
2GX8
Number of Functions
1
Number of Terminals
50
Terminal Pitch (mm)
0.5
Number of Words Code
2G
Memory Density (bits)
17179869184
Package Body Material
PLASTIC/EPOXY
Seated Height-Max (mm)
4.1
Supply Voltage-Max (V)
3.6
Supply Voltage-Min (V)
3
Supply Voltage-Nom (V)
3.3
Data Retention Time-Min
10
Number of Words (words)
2147483648
Programming Voltage (V)
3.3
Standby Current-Max (A)
5.0E-5
Supply Current-Max (mA)
50
Package Equivalence Code
SOP50,.8,20
Endurance (Write/Erase Cycles)
100000
Operating Temperature-Max (Cel)
85
Operating Temperature-Min (Cel)
-40