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3DEE8M08VS8190CN

3D PLUS SA

3D PLUS SA 3DEE8M08VS8190CN
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Technology
    CMOS
  • Width (mm)
    11.7
  • Length (mm)
    13.2
  • JESD-30 Code
    R-PDSO-G40
  • Memory Width
    8
  • Package Code
    SSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory IC Type
    EEPROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    1MX8
  • Number of Functions
    1
  • Number of Terminals
    40
  • Terminal Pitch (mm)
    0.5
  • Access Time-Max (ns)
    250
  • Number of Words Code
    1M
  • Memory Density (bits)
    8388608
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    12.15
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3
  • Number of Words (words)
    1048576
  • Programming Voltage (V)
    3
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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3DEE8M08VS8190CN
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3DEE8M08VS8190CN