3D PLUS SA 3D3D8G32YB2496MS-00 | 搜芯易Sourcengine

3D PLUS SA 3D3D8G32YB2496MS-00

生命周期状态
Contact Mfr
说明
DDR3L DRAM, 256MX32, CMOS, PBGA136
类别
Semiconductors Memory ICs DRAMs DDR3L DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Width
10.8 mm
Length
14.8 mm
Technology
CMOS
Access Mode
MULTI BANK PAGE BURST
JESD-30 Code
R-PBGA-B136
Memory Width
32
Organization
256MX32
Package Code
FBGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
8589934592 bit
Memory IC Type
DDR3L DRAM
Operating Mode
SYNCHRONOUS
Terminal Pitch
0.8 mm
Number of Ports
1
Number of Words
268435456 words
Seated Height-Max
3.3 mm
Temperature Grade
MILITARY
Terminal Position
BOTTOM
Additional Feature
SELF REFRESH; SEATED HGT-NOM
Number of Functions
1
Number of Terminals
136
Number of Words Code
256M
Package Body Material
PLASTIC/EPOXY
Operating Temperature-Max
125 Cel
Operating Temperature-Min
-55 Cel
Supply Voltage-Max (Vsup)
1.45 V
Supply Voltage-Min (Vsup)
1.283 V
Supply Voltage-Nom (Vsup)
1.35 V