3D PLUS SA 3D3D8G16WB2392CN-H9 | 搜芯易Sourcengine

3D PLUS SA 3D3D8G16WB2392CN-H9

生命周期状态
Contact Mfr
说明
DDR3 DRAM, 512MX16, CMOS, PBGA96
类别
Semiconductors Memory ICs DRAMs DDR3 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Width
10.7 mm
Technology
CMOS
Access Mode
MULTI BANK PAGE BURST
JESD-30 Code
R-PBGA-B96
Memory Width
16
Organization
512MX16
Package Code
FBGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
8589934592 bit
Memory IC Type
DDR3 DRAM
Operating Mode
SYNCHRONOUS
Terminal Pitch
0.8 mm
Number of Ports
1
Number of Words
536870912 words
Seated Height-Max
3.4 mm
Terminal Position
BOTTOM
Additional Feature
SELF REFRESH
Number of Functions
1
Number of Terminals
96
Number of Words Code
512M
Package Body Material
PLASTIC/EPOXY
Supply Voltage-Max (Vsup)
1.575 V
Supply Voltage-Min (Vsup)
1.425 V
Supply Voltage-Nom (Vsup)
1.5 V