3D PLUS SA 3D3D8G08WB2335-IS-H9 | 搜芯易Sourcengine

3D PLUS SA 3D3D8G08WB2335-IS-H9

生命周期状态
Contact Mfr
说明
DDR3 DRAM, 1GX8, 0.255ns, CMOS, PBGA78
类别
Semiconductors Memory ICs DRAMs DDR3 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
R-PBGA-B78
Memory Width
8
Organization
1GX8
Package Code
FBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
8589934592 bit
Memory IC Type
DDR3 DRAM
Refresh Cycles
8192
Terminal Pitch
0.8 mm
Access Time-Max
0.255 ns
Number of Words
1073741824 words
Screening Level
ESCC9000
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Supply Current-Max
192 mA
Number of Terminals
78
Standby Current-Max
0.044 Amp
Number of Words Code
1G
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Sequential Burst Length
8
Interleaved Burst Length
8
Package Equivalence Code
BGA78,9X13,32
Operating Temperature-Max
95 Cel
Operating Temperature-Min
-40 Cel
Supply Voltage-Nom (Vsup)
1.5 V
Clock Frequency-Max (fCLK)
667 MHz