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3D3D4G08WB2331-M

3D PLUS SA

3D PLUS SA 3D3D4G08WB2331-M
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • Width
    9.6 mm
  • Length
    12.1 mm
  • Technology
    CMOS
  • Access Mode
    MULTI BANK PAGE BURST
  • JESD-30 Code
    R-PBGA-B78
  • Memory Width
    8
  • Organization
    512MX8
  • Package Code
    FBGA
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    4294967296 bit
  • Memory IC Type
    DDR3 DRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    0.8 mm
  • Number of Ports
    1
  • Number of Words
    536870912 words
  • Seated Height-Max
    3.4 mm
  • Temperature Grade
    MILITARY
  • Terminal Position
    BOTTOM
  • Additional Feature
    SELF REFRESH
  • Number of Functions
    1
  • Number of Terminals
    78
  • Number of Words Code
    512M
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -55 Cel
  • Supply Voltage-Max (Vsup)
    1.575 V
  • Supply Voltage-Min (Vsup)
    1.425 V
  • Supply Voltage-Nom (Vsup)
    1.5 V

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