3D PLUS SA 3D2D8G72UB3369-M-6E | 搜芯易Sourcengine

3D PLUS SA 3D2D8G72UB3369-M-6E

生命周期状态
Contact Mfr
说明
DDR DRAM Module, 128MX72, 0.45ns, CMOS, PBGA208
类别
Semiconductors Memory ICs DRAMs DDR DRAM MODULE

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.02
SB Code
8542.32.00.15

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
R-PBGA-B208
Memory Width
72
Organization
128MX72
Package Code
BGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
9437184 bit
Memory IC Type
DDR DRAM MODULE
Refresh Cycles
8192
Terminal Pitch
1 mm
Access Time-Max
0.45 ns
Number of Words
134217728 words
Temperature Grade
MILITARY
Terminal Position
BOTTOM
Supply Current-Max
500 mA
Number of Terminals
208
Standby Current-Max
0.06 Amp
Number of Words Code
128M
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Package Equivalence Code
BGA208,11X19,40
Operating Temperature-Max
125 Cel
Operating Temperature-Min
-55 Cel
Supply Voltage-Nom (Vsup)
1.8 V
Clock Frequency-Max (fCLK)
333 MHz