3D PLUS SA 3D2D4G16UB2303-IS-5C | 搜芯易Sourcengine

3D PLUS SA 3D2D4G16UB2303-IS-5C

生命周期状态
Contact Mfr
说明
DDR2 DRAM, 256MX16, 0.5ns, CMOS, PBGA87
类别
Semiconductors Memory ICs DRAMs DDR2 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

I/O Type
COMMON
Technology
CMOS
JESD-30 Code
R-PBGA-B87
Memory Width
16
Organization
256MX16
Package Code
FBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
4294967296 bit
Memory IC Type
DDR2 DRAM
Refresh Cycles
8192
Terminal Pitch
0.8 mm
Access Time-Max
0.5 ns
Number of Words
268435456 words
Screening Level
ESCC9000
Temperature Grade
INDUSTRIAL
Terminal Position
BOTTOM
Supply Current-Max
150 mA
Number of Terminals
87
Standby Current-Max
0.015 Amp
Number of Words Code
256M
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Sequential Burst Length
4,8
Interleaved Burst Length
4,8
Package Equivalence Code
BGA87,9X15,32
Operating Temperature-Max
85 Cel
Operating Temperature-Min
-40 Cel
Supply Voltage-Nom (Vsup)
1.8 V
Clock Frequency-Max (fCLK)
266 MHz