3D PLUS SA 3D2D2G08UB2327MS-4A | 搜芯易Sourcengine

3D PLUS SA 3D2D2G08UB2327MS-4A

生命周期状态
Contact Mfr
说明
DDR2 DRAM, 256MX8, 0.6ns, CMOS, PBGA63
类别
Semiconductors Memory ICs DRAMs DDR2 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Width
11.55 mm
Length
12.25 mm
I/O Type
COMMON
Technology
CMOS
Access Mode
MULTI BANK PAGE BURST
JESD-30 Code
R-PBGA-B63
Memory Width
8
Organization
256MX8
Package Code
FBGA
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH Meter
Surface Mount
YES
Terminal Form
BALL
Memory Density
2147483648 bit
Memory IC Type
DDR2 DRAM
Operating Mode
SYNCHRONOUS
Refresh Cycles
8192
Terminal Pitch
0.8 mm
Access Time-Max
0.6 ns
Number of Ports
1
Number of Words
268435456 words
Screening Level
ESCC9000
Seated Height-Max
3.1 mm
Temperature Grade
MILITARY
Terminal Position
BOTTOM
Additional Feature
SELF REFRESH
Supply Current-Max
115 mA
Number of Functions
1
Number of Terminals
63
Standby Current-Max
0.01 Amp
Number of Words Code
256M
Qualification Status
Not Qualified
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Sequential Burst Length
4,8
Interleaved Burst Length
4,8
Package Equivalence Code
BGA63,9X11,32
Operating Temperature-Max
125 Cel
Operating Temperature-Min
-55 Cel
Supply Voltage-Max (Vsup)
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Clock Frequency-Max (fCLK)
200 MHz