3D PLUS SA 3D1D2G08TS2240SC | 搜芯易Sourcengine

3D PLUS SA 3D1D2G08TS2240SC

生命周期状态
Discontinued
说明
DDR1 DRAM, 256MX8, CMOS, PDSO66
类别
Semiconductors Memory ICs DRAMs DDR1 DRAM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Width
10.95 mm
Length
24 mm
Technology
CMOS
Access Mode
SINGLE BANK PAGE BURST
JESD-30 Code
R-PDSO-G66
Memory Width
8
Organization
256MX8
Package Code
SSOP
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH Meter
Surface Mount
YES
Terminal Form
GULL WING
Memory Density
2147483648 bit
Memory IC Type
DDR1 DRAM
Operating Mode
SYNCHRONOUS
Terminal Pitch
0.8 mm
Number of Ports
1
Number of Words
268435456 words
Seated Height-Max
5.25 mm
Terminal Position
DUAL
Additional Feature
AUTO/SELF REFRESH
Number of Functions
1
Number of Terminals
66
Number of Words Code
256M
Package Body Material
PLASTIC/EPOXY
Supply Voltage-Max (Vsup)
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V