375024B60024G
BOYD CORP
- 生命周期状态Active
- RoHS符合RoHS标准
- 说明Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 12.2°C/W Black Anodized
- 类别
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8541.90.00.00
- SB Code8541.90.00.00
- ColorBLACK
- FinishANODIZED
- ProfilePIN FIN ARRAY
- Width (mm)40
- Height (mm)18
- Length (mm)40
- ConstructionCLIP
- Body MaterialALUMINUM
- Fin OrientationOMNIDIRECT
- Thermal Support Device TypeHEAT SINK
375024B60024G有0家供应商货源可供购买或竞价
提交询价
提交询价 您的询价单将直接发送给我们的销售专家: Pari
提交询价
375024B60024G
提交询价
375024B60024G