374124B00032G
BOYD CORP
- 生命周期状态Active
- RoHS符合RoHS标准
- 说明BOYD - 374124B00032G - Heat Sink, Square, PCB, For Ball Grid Arrays, 23.4 °C/W, BGA, 23 mm, 18.01 mm, 23 mm
- 类别
- ECCNEAR99
- ECCN GovernanceEAR
- HTS Code8541.90.00.00
- SB Code8541.90.00.00
- ColorBLACK
- FinishANODIZED
- ProfilePIN FIN ARRAY
- Width (mm)23
- Height (mm)18
- Length (mm)23
- ConstructionFIN
- Body MaterialALUMINUM
- Fin OrientationOMNIDIRECT
- Thermal Support Device TypeHEAT SINK
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374124B00032G
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374124B00032G