TEKCON ELECTRONICS CORP 1512-700-28 | 搜芯易Sourcengine

TEKCON ELECTRONICS CORP 1512-700-28

生命周期状态
Contact Mfr
说明
IC Socket, SIP28, 28 Contact(s), 2.54mm Term Pitch, Solder
类别
Interconnects Sockets and Chip Carriers

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8536.69.40.40
SB Code
8536.69.40.40

Body Depth
0.159 inch
Body Length
2.8 inch
Body Breadth
0.1 inch
Contact Style
RND PIN-SKT
Current Rating
1 A
Mounting Style
STRAIGHT
Terminal Pitch
2.54 mm
Contact Material
BE-CU
Housing Material
GLASS FILLED THERMOPLASTIC
Termination Type
SOLDER
Device Socket Type
IC SOCKET
Number of Contacts
28
Device Type Used On
SIP28
PCB Contact Pattern
RECTANGULAR
Mating Contact Pitch
0.1 inch
Insulation Resistance
5000000000 ohm
Contact Finish - Mating
AU
Operating Temperature-Max
125 Cel
Operating Temperature-Min
-55 Cel
Contact Finish - Termination
TIN
Dielectric Withstanding Voltage
500VAC V