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100322DM

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP 100322DM
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Family
    100K
  • Technology
    ECL
  • Width (mm)
    10.16
  • JESD-30 Code
    R-GDIP-T24
  • Package Code
    DIP
  • Logic IC Type
    BUFFER
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Schmitt Trigger
    NO
  • Terminal Finish
    TIN LEAD
  • Number of Inputs
    1
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Number of Functions
    9
  • Number of Terminals
    24
  • Terminal Pitch (mm)
    2.54
  • Package Body Material
    CERAMIC, GLASS-SEALED
  • Output Characteristics
    OPEN-EMITTER
  • Propagation Delay (ns)
    1.8
  • Seated Height-Max (mm)
    5.72
  • Supply Current-Max (mA)
    70
  • Package Equivalence Code
    DIP24,.4
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Propagation Delay-Max@Nom-Sup (ns)
    1.8

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100322DM
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100322DM